TitleProduct

Tin Solder Bar Lead Free Solder Bar/Rog Sn0.7CuNi

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Jiangsu

  • Validity to:

    Long-term effective

  • Last update:

    2017-12-10 15:23

  • Browse the number:

    250

Send an inquiries

Company Profile

Suzhou Lihng Electronic Technology Co., Ltd.

By certification [File Integrity]

Contact:Mr. Bill(Mr.)  

Email:

Telephone:

Area:Jiangsu

Address:Jiangsu

Website: http://suzhouliheng.amfp-inc.com/

Product Details




1. Application
The product is lead free solder bar, used in electronics parts and Electrical appliance.

2.The chemical composition
2.1
 Main ingredient
  Main ingredient(wt%)
Cu Ni Sn
0.7(±0.1) 0.05(±0.01) Balance
2.2 Impurity of solder alloy
Impurity of solder alloy(wt%) Max
Pb Sb Bi P Fe Al Zn As In Cd
0.03 0.05 0.1 0.003 0.02 0.001 0.001 0.03 0.05 0.002

3. Form, Diameter ,Weight and Tolerance
Form Dimension and Tolerance(mm) Weight
 
Bar
Length 323.0 ±5.0
715g/Pc
(±5g)
Width 20.0 ±2.5
Height 15.0 ±1.5

4.Physical Property of solder alloy(Reference Value)
Melting Point Specific Gravity Tensile Strength Elongation Working Point
227 ºC 7.4±0.2 34Mpa 38% 260-290ºC

5.Unit mass and Packaging
 
 Packaging  
Type   N.W/CTN G.W/CTN    
corrugated
 box
20KG±100g 20.3KG±100g